DocumentCode :
2931260
Title :
Gate length scaling and high drive currents enabled for high performance SOI technology using high-κ/metal gate
Author :
Henson, K. ; Bu, H. ; Na, M.H. ; Liang, Y. ; Kwon, U. ; Krishnan, S. ; Schaeffer, Jonathan ; Jha, R. ; Moumen, N. ; Carter, R. ; DeWan, C. ; Donaton, R. ; Guo, D. ; Hargrove, W. ; He, W. ; Mo, R. ; Ramachandran, R. ; Ramani, K. ; Schonenberg, K. ; Tsang,
Author_Institution :
Semicond. Res. & Dev. Center (SRDC), IBM, Hopewell Junction, NY
fYear :
2008
fDate :
15-17 Dec. 2008
Firstpage :
1
Lastpage :
4
Abstract :
CMOS devices with high-k/metal gate stacks have been fabricated using a gate-first process flow and conventional stressors at gate lengths of 25 nm, highlighting the scalability of this approach for high performance SOI CMOS technology. AC drive currents of 1630muA/mum and 1190muA/mum have been demonstrated in 45 nm ground-rules at 1V and 200nA/mum off current for nFETs and pFETs, at a Tinv of 14 and 15 respectively. The drive currents were achieved using a simplified high-k/metal gate integration scheme with embedded SiGe and dual stress liners (DSL) and without utilizing additional stress enhancers. Devices have been fabricated with Tinv´s down to 12 and 10.5 demonstrating the scalability of this approach for 32 nm and beyond.
Keywords :
CMOS integrated circuits; field effect transistors; silicon-on-insulator; AC drive currents; CMOS devices; dual stress liners; gate length scaling; gate-first process flow; high drive currents; high performance SOI CMOS technology; high performance SOI technology; high-k/metal gate stacks; CMOS process; CMOS technology; Germanium silicon alloys; Helium; High K dielectric materials; High-K gate dielectrics; Research and development; Scalability; Silicon germanium; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2008. IEDM 2008. IEEE International
Conference_Location :
San Francisco, CA
ISSN :
8164-2284
Print_ISBN :
978-1-4244-2377-4
Electronic_ISBN :
8164-2284
Type :
conf
DOI :
10.1109/IEDM.2008.4796774
Filename :
4796774
Link To Document :
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