• DocumentCode
    2931875
  • Title

    Record PVCR GaAs-based tunnel diodes fabricated on Si substrates using aspect ratio trapping

  • Author

    Rommel, S.L. ; Pawlik, D. ; Thomas, P. ; Barth, M. ; Johnson, K. ; Kurinec, S.K. ; Seabaugh, A. ; Cheng, Z. ; Li, J.Z. ; Park, J.-S. ; Hydrick, J.M. ; Bai, J. ; Carroll, M. ; Fiorenza, J.G. ; Lochtefeld, A.

  • Author_Institution
    Dept. of Microelectron. Eng., Rochester Inst. of Technol., Rochester, NY
  • fYear
    2008
  • fDate
    15-17 Dec. 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    High quality, low defect GaAs virtual substrates on Si, produced by the aspect ratio trapping growth technique, have been used for the fabrication of n+GaAs/n+InGaAs/p+GaAs Esaki diodes. All epitaxial layers were grown by reduced-pressure chemical vapor deposition/metalorganic chemical vapor deposition , instead of the molecular beam epitaxy technique commonly used for most high performance Esaki diodes. Four Esaki diode structures were fabricated and measured, with current densities up to 1 kA/cm2. Peak-to-valley current ratios up to 56 have been achieved, which is greater than twice that of the best GaAs Esaki diodes previously reported.
  • Keywords
    III-V semiconductors; chemical vapour deposition; current density; gallium arsenide; semiconductor device measurement; semiconductor growth; silicon; tunnel diodes; Esaki diode; GaAs-InGaAs; PVCR; Si; aspect ratio trapping; chemical vapor deposition; current densities; metalorganic chemical vapor deposition; peak-to-valley current ratios; tunnel diodes; Chemical vapor deposition; Current measurement; Density measurement; Diodes; Epitaxial layers; Fabrication; Gallium arsenide; Indium gallium arsenide; Molecular beam epitaxial growth; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2008. IEDM 2008. IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    8164-2284
  • Print_ISBN
    978-1-4244-2377-4
  • Electronic_ISBN
    8164-2284
  • Type

    conf

  • DOI
    10.1109/IEDM.2008.4796801
  • Filename
    4796801