Title :
Millimeter-wave packaging
Author :
Kuno, H.J. ; Midford, T.A.
Author_Institution :
Hughes Aircraft Co., Torrance, CA, USA
Abstract :
The authors reviewed the state of the art in millimeter-wave packaging and analyzed its potentials and limitations. Based on the analysis of the requirements and technology development, the following trends can be expected for millimeter-wave packages: (1) packaging at higher levels of integration-the advent of millimeter-wave multichip packages; (2) the substantially increased use of electromagnetic simulation design tools; (3) the introduction of new materials and processes, for example AlN and cofired ceramic techniques; (4) the integration of a considerably higher complexity and multiplicity of electronic functions within the package envelope; and (5) a substantial reduction in the size, weight, and cost of millimeter-wave packages.<>
Keywords :
MMIC; integrated circuit technology; microwave devices; microwave integrated circuits; multichip modules; packaging; AlN; MM-wave type; cofired ceramic; electromagnetic simulation design tools; millimeter-wave packages; multichip packages; Aircraft; Degradation; Electronics packaging; Heat sinks; Integrated circuit packaging; Millimeter wave integrated circuits; Millimeter wave technology; Packaging machines; Phased arrays; Radio frequency;
Conference_Titel :
Microwave Symposium Digest, 1992., IEEE MTT-S International
Conference_Location :
Albuquerque, NM, USA
Print_ISBN :
0-7803-0611-2
DOI :
10.1109/MWSYM.1992.188299
