DocumentCode
2932251
Title
A G-CSF functionalized PLLA scaffold for wound repair: An in vitro preliminary study
Author
Spadaccio, Cristiano ; Rainer, Alberto ; Porcellinis, Stefano De ; Centola, Matteo ; Marco, Federico De ; Chello, Massimo ; Trombetta, Marcella ; Genovese, Jorge A.
Author_Institution
Area of Cardiovascular Surg., Univ. Campus Bio-Medico of Rome, Rome, Italy
fYear
2010
fDate
Aug. 31 2010-Sept. 4 2010
Firstpage
843
Lastpage
846
Abstract
Targeting wound repair, we developed an electrospun poly-L-lactide fibrous scaffold functionalized with G-CSF, a growth factor which is widely recognized as important in wound healing homeostasis. The scaffold was characterized in terms of morphology, mechanical properties and in vitro capacity to induce organization of co-cultures of murine fibroblasts and keratinocytes into a dermo-epidermal multilayered structure. Our findings are consistent with the promotion of a nonhostile environment, in which seeded cells could arrange themselves in an appropriate topographic distribution of elements at different levels of maturation up to a cornified epithelium on the top layer, resembling native skin.
Keywords
biomedical materials; cellular biophysics; polymer fibres; skin; stress-strain relations; tissue engineering; wounds; G-CSF growth factor; cornified epithelium; dermo-epidermal multilayered structure; electrospun poly-L-lactide fibrous scaffold; element topographic distribution; in vitro capacity; keratinocytes; mechanical properties; murine fibroblasts; native skin; stress-strain curves; wound healing homeostasis; wound repair; Drugs; Fibroblasts; In vitro; Maintenance engineering; Skin; Tissue engineering; Wounds; Animals; Drug Implants; Equipment Design; Equipment Failure Analysis; Granulocyte Colony-Stimulating Factor; Humans; Intercellular Signaling Peptides and Proteins; Lactic Acid; Pilot Projects; Polymers; Tissue Scaffolds; Treatment Outcome; Wound Healing; Wounds and Injuries;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
Conference_Location
Buenos Aires
ISSN
1557-170X
Print_ISBN
978-1-4244-4123-5
Type
conf
DOI
10.1109/IEMBS.2010.5626796
Filename
5626796
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