DocumentCode
2932456
Title
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)
fYear
1999
fDate
1-4 June 1999
Abstract
The following topics were dealt with. WDM; underfill processing; embedded passive components; solder reliability; packaging; optoelectronic modules; flip chip packages; electrically conductive adhesives; optical connectors; interconnects; electric connectors; transceivers; multichip packaging; plastic packaging; optical interconnects; delamination; education; and thermomechanical stress
Keywords
adhesives; delamination; electric connectors; electronic engineering education; encapsulation; flip-chip devices; integrated circuit interconnections; multichip modules; optical couplers; optical interconnections; optoelectronic devices; packaging; plastic packaging; reliability; soldering; thermal stresses; transceivers; wavelength division multiplexing; WDM; delamination; education; electric connectors; electrically conductive adhesives; embedded passive components; flip chip packages; interconnects; multichip packaging; optical connectors; optical interconnects; optoelectronic modules; packaging; plastic packaging; solder reliability; thermomechanical stress; transceivers; underfill processing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location
San Diego, CA, USA
ISSN
0569-5503
Print_ISBN
0-7803-5231-9
Type
conf
DOI
10.1109/ECTC.1999.776054
Filename
776054
Link To Document