DocumentCode :
2932483
Title :
Packaging trends for semiconductor lasers for DWDM-applications
Author :
Vreeburg, C.G.M. ; Groeneveld, C.M.
Author_Institution :
Uniphase Netherlands BV, Eindhoven, Netherlands
fYear :
1999
fDate :
1999
Firstpage :
1
Lastpage :
4
Abstract :
DWDM systems with up to 100 channels are nowadays an established technology to increase the capacity of an optical fiber. For DWDM lasers a small line-width and a stable wavelength are required. Not only the spectral behavior of the lasers is important but also the physical dimensions of the laser module, length of the fiber pigtail and the size of the connectors are becoming important if up to 100 lasers are used in a single DWDM system. In addition with an increasing stacking density of active devices, power consumption management is becoming important
Keywords :
distributed feedback lasers; laser beam applications; laser stability; modules; optical communication equipment; semiconductor device packaging; semiconductor lasers; thermal management (packaging); wavelength division multiplexing; DFB lasers; DWDM applications; connector size; dense WDM systems; fiber pigtail; laser module; long-term stability; optical fiber; packaging trends; power consumption management; semiconductor lasers; stable wavelength; stacking density; Connectors; Fiber lasers; Laser stability; Laser theory; Optical fiber devices; Optical fibers; Semiconductor device packaging; Semiconductor lasers; Stacking; Wavelength division multiplexing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
0-7803-5231-9
Type :
conf
DOI :
10.1109/ECTC.1999.776055
Filename :
776055
Link To Document :
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