DocumentCode
2932672
Title
Yield enhancement flow for analog and full custom designs reliability-rules automatic application
Author
Abdulghany, Ahmad ; Fathy, Rami ; Capodieci, Luigi ; Malik, Shobhit
Author_Institution
Consulting Div., Mentor Graphics, USA
fYear
2011
fDate
11-14 Dec. 2011
Firstpage
74
Lastpage
77
Abstract
As the variations of shrunk processes increase at rapid rate, the performance of fabricated analog and full custom chips remarkably fluctuate. This paper describes an effective automatic flow for reliability rules automatic application onto analog and full-custom ASIC designs, without introducing any new design rules check (DRC) violations in input design. This Yield enhancement flow has shown good improvements on used test designs, and ran in reasonable time. Based on the standardization methodology used, additional foundry Yield-enhancement-related recommendations can be also developed as extension to this flow seamlessly providing easy and quick new technology adoption and short Turnaround Time (TAT).
Keywords
application specific integrated circuits; design engineering; reliability; semiconductor industry; ASIC designs; foundry yield-enhancement; reliability-rules automatic application; turnaround time; yield enhancement flow; Filtering; Foundries; Layout; Manufacturing; Metals; Optimization; Reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Test Workshop (IDT), 2011 IEEE 6th International
Conference_Location
Beirut
ISSN
2162-0601
Print_ISBN
978-1-4673-0468-9
Electronic_ISBN
2162-0601
Type
conf
DOI
10.1109/IDT.2011.6123105
Filename
6123105
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