DocumentCode
2932699
Title
A model of the underfill flow process: particle distribution effects
Author
Guo, Y. ; Lehman, G.L. ; Driscoll, T. ; Cotts, E.J.
Author_Institution
Dept. of Mech. Eng., State Univ. of New York, Binghamton, NY, USA
fYear
1999
fDate
1999
Firstpage
71
Lastpage
76
Abstract
Key features of the underfill flow process are simulated by investigating the capillary flow of a dense suspension into a plane channel. A flow model is posed which includes submodels for wetting and rheology. The infiltration rate is successfully predicted if the velocity and particle concentration fields are modeled by coupled transport equations
Keywords
capillarity; channel flow; flow simulation; packaging; suspensions; two-phase flow; wetting; capillary flow model; dense suspension; direct chip attachment packaging; material infiltration; particle concentration field; particle distribution; plane channel; rheology; simulation; transport equation; underfill flow process; velocity concentration field; wetting; Material properties; Mechanical engineering; Physics; Predictive models; Rheology; Shape; Solid modeling; Stress; Surface tension; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
0-7803-5231-9
Type
conf
DOI
10.1109/ECTC.1999.776066
Filename
776066
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