Title :
A model of the underfill flow process: particle distribution effects
Author :
Guo, Y. ; Lehman, G.L. ; Driscoll, T. ; Cotts, E.J.
Author_Institution :
Dept. of Mech. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
Key features of the underfill flow process are simulated by investigating the capillary flow of a dense suspension into a plane channel. A flow model is posed which includes submodels for wetting and rheology. The infiltration rate is successfully predicted if the velocity and particle concentration fields are modeled by coupled transport equations
Keywords :
capillarity; channel flow; flow simulation; packaging; suspensions; two-phase flow; wetting; capillary flow model; dense suspension; direct chip attachment packaging; material infiltration; particle concentration field; particle distribution; plane channel; rheology; simulation; transport equation; underfill flow process; velocity concentration field; wetting; Material properties; Mechanical engineering; Physics; Predictive models; Rheology; Shape; Solid modeling; Stress; Surface tension; Viscosity;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776066
