Body contact based TSV equalizer

This paper shows that the TSV capacitance is highly dependent on the placement and count of adjacent ground body contacts and has a value of tens of femto farads in a typical current technology. Simulations show that the total TSV capacitance increases with the increase in the body contacts count or the closer the body contacts are to the TSV. This increase is due to the fact that the more body contacts, the closer the effective virtual ground plate of the TSV capacitance. Body contacts reduce the crosstalk and distortion caused by the TSV interconnects in a 3D IC system. Moreover, it alleviates noise coupling.