Title :
Effects of laboratory-scale IC attachment methods on passive UHF RFID tag performance
Author :
Koski, Karoliina ; Koski, Eveliina ; Ukkonen, Leena ; Sydänheimo, Lauri ; Björninen, Toni ; Virtanen, Juha ; Elsherbeni, Atef Z.
Author_Institution :
Dept. of Electron., Tampere Univ. of Technol., Tampere, Finland
Abstract :
This paper presents laboratory-scale methods for attaching integrated circuits (ICs) to passive ultra high frequency (UHF) radio frequency identification (RFID) antennas and discusses the effects of the attaching methods on tag performance. Commercial passive UHF RFID ICs were used. The studied attachment methods were strap attachment and direct IC attachment. One antenna design was developed for strap attachment where the IC was attached together with a strap, and two different antenna designs were developed for direct chip attachment. In addition, etched copper loop arm antennas for strap attachment and inkjet-printed loop arm antennas for direct chip attachment were studied. The measurement results show that the interconnection between the IC and the antenna is of paramount importance and that the performance of the tag is strongly dependent on the quality of the interconnection. The results of this study provide knowledge for reliable IC attachment in prototype laboratory conditions.
Keywords :
UHF antennas; UHF integrated circuits; integrated circuit interconnections; loop antennas; microstrip antennas; radiofrequency identification; IC interconnection; direct chip attachment; etched copper loop arm antenna; inkjet-printed loop arm antenna; laboratory-scale IC attachment method; laboratory-scale integrated circuit attachment method; passive UHF RFID tag antenna; passive ultra high frequency radio frequency identification tag antenna; strap attachment; Antenna measurements; Antennas; Integrated circuits; Prototypes; Radiofrequency identification; Reliability; Substrates; ACA; DCA; Flip-Chip; Interconnection; Passive; RFID; Strap;
Conference_Titel :
Antennas and Propagation (APSURSI), 2011 IEEE International Symposium on
Conference_Location :
Spokane, WA
Print_ISBN :
978-1-4244-9562-7
DOI :
10.1109/APS.2011.5996448