DocumentCode
2933667
Title
Write stress reduction in 50nm Alx Oy ReRAM improves endurance 1.4× and write time, energy by 17%
Author
Sheyang Ning ; Iwasaki, Tomoko Ogura ; Takeuchi, Ken
Author_Institution
Chuo Univ., Tokyo, Japan
fYear
2013
fDate
26-29 May 2013
Firstpage
56
Lastpage
59
Abstract
Novel write verification methods are proposed to improve write speed, energy and endurance of resistive random access memory (ReRAM). Flexible write stress is implemented during reset w/ verification and set w/ verification, by which the pulse width or voltage can be decremented as well as incremented. Proposed reset w/ verification and set w/ verification methods are characterized by measuring 50nm AlxOy ReRAM devices and compared against conventional methods. Improvements of 1.9× average endurance increase, or 1.4× average endurance increase with 17% write time, the reset time plus set time decrease and 17% average write energy reduction are demonstrated.
Keywords
aluminium compounds; random-access storage; AlxOy; ReRAM; flexible write stress; resistive random access memory; size 50 nm; stress reduction; write energy reduction; write verification methods; Acceleration; Current measurement; Proposals; Resistance; Stress; Switches; Voltage measurement; ReRAM; ReRAM endurance; ReRAM write energy; ReRAM write speed; write with verification;
fLanguage
English
Publisher
ieee
Conference_Titel
Memory Workshop (IMW), 2013 5th IEEE International
Conference_Location
Monterey, CA
Print_ISBN
978-1-4673-6168-2
Type
conf
DOI
10.1109/IMW.2013.6582097
Filename
6582097
Link To Document