DocumentCode :
2933667
Title :
Write stress reduction in 50nm AlxOy ReRAM improves endurance 1.4× and write time, energy by 17%
Author :
Sheyang Ning ; Iwasaki, Tomoko Ogura ; Takeuchi, Ken
Author_Institution :
Chuo Univ., Tokyo, Japan
fYear :
2013
fDate :
26-29 May 2013
Firstpage :
56
Lastpage :
59
Abstract :
Novel write verification methods are proposed to improve write speed, energy and endurance of resistive random access memory (ReRAM). Flexible write stress is implemented during reset w/ verification and set w/ verification, by which the pulse width or voltage can be decremented as well as incremented. Proposed reset w/ verification and set w/ verification methods are characterized by measuring 50nm AlxOy ReRAM devices and compared against conventional methods. Improvements of 1.9× average endurance increase, or 1.4× average endurance increase with 17% write time, the reset time plus set time decrease and 17% average write energy reduction are demonstrated.
Keywords :
aluminium compounds; random-access storage; AlxOy; ReRAM; flexible write stress; resistive random access memory; size 50 nm; stress reduction; write energy reduction; write verification methods; Acceleration; Current measurement; Proposals; Resistance; Stress; Switches; Voltage measurement; ReRAM; ReRAM endurance; ReRAM write energy; ReRAM write speed; write with verification;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Memory Workshop (IMW), 2013 5th IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4673-6168-2
Type :
conf
DOI :
10.1109/IMW.2013.6582097
Filename :
6582097
Link To Document :
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