• DocumentCode
    2934382
  • Title

    Implmentation of digital audio effect SoC

  • Author

    Byun, Kyungjin ; Kwon, Young-Su ; Koo, Bon-tae ; Eum, Nak-Woong ; Jeong, Koang-Hui ; Koo, Jae-Eul

  • Author_Institution
    Electron. & Telecommun. Res. Inst. (ETRI), Daejeon, South Korea
  • fYear
    2009
  • fDate
    June 28 2009-July 3 2009
  • Firstpage
    1194
  • Lastpage
    1197
  • Abstract
    This paper describes the implementation of digital audio effect SoC (system on chip) which integrates the embedded DSP core, audio codec IP, a number of peripheral blocks and various audio effect algorithms. The audio effect SoC is developed by a software and hardware co-design method. The embedded DSP and some dedicated hardware blocks are developed as a hardware design while the audio effect algorithms are realized by a software centric way. In the implementation of audio effects, we employ the primitive functions of the embedded DSP compiler which provide the efficient way to implement the audio effect algorithms. Most of the algorithms are implemented by C language with the primitive functions and they are run on the embedded DSP while the equalizer which requires a large amount of computing power is implemented by the dedicated hardware block with high flexibility. The audio effect SoC was fabricated by using 0.18 um CMOS process and it was evaluated successfully on the real-time test board.
  • Keywords
    C language; CMOS digital integrated circuits; digital signal processing chips; hardware-software codesign; system-on-chip; C language; CMOS process; audio codec IP; digital audio effect SoC; embedded DSP core; peripheral blocks; size 0.18 mum; software and hardware codesign method; software centric way; system on chip; Algorithm design and analysis; Codecs; Digital signal processing; Digital signal processing chips; Embedded computing; Embedded software; Equalizers; Hardware; Software algorithms; System-on-a-chip; DSP; Digital audio effects; SoC;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multimedia and Expo, 2009. ICME 2009. IEEE International Conference on
  • Conference_Location
    New York, NY
  • ISSN
    1945-7871
  • Print_ISBN
    978-1-4244-4290-4
  • Electronic_ISBN
    1945-7871
  • Type

    conf

  • DOI
    10.1109/ICME.2009.5202714
  • Filename
    5202714