Title :
Fatigue life prediction of flip-chips in terms of nonlinear behavior of solder and underfill
Author :
Zhengfang Qian ; Minfu Lu ; Sheng Liu
Author_Institution :
Electron. Packaging Lab., Wayne State Univ., Detroit, MI
Abstract :
The nonlinear properties of eutectic solder and underfill FP4526 have been reported and incorporated into ABAQUS material model library for the fatigue life prediction of advanced electronic packages. The methods of unified constitutive modeling, separated constitutive modeling, and fatigue life prediction have been described and compared in detail. The nonlinear constitutive modeling of solder alloys and underfills plays an important role in the life prediction in terms of the correct calculation of inelastic strain range and inelastic strain energy density of hysteresis loop under various accelerated test conditions. Combined with unified constitutive modeling, strain-based approach of life prediction is recommended in this paper. The analyses performed in this report present valuable insights for the design of advanced flip-chip packages
Keywords :
encapsulation; fatigue; finite element analysis; flip-chip devices; integrated circuit modelling; integrated circuit packaging; life testing; ABAQUS material model library; accelerated test conditions; advanced electronic packages; eutectic solder; fatigue life prediction; flip-chip packages; hysteresis loop; inelastic strain energy density; inelastic strain range; nonlinear behavior; separated constitutive modeling; underfill; unified constitutive modeling; Capacitive sensors; Electronics packaging; Fatigue; Flip chip; Libraries; Performance analysis; Predictive models; Soldering; Temperature; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776162
