DocumentCode :
2934467
Title :
Antenna in package design for WLAN using MCM-D manufacturing technology
Author :
Tang, Tzu-Chun ; Lin, Ken-Huang
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-sen Univ., Kaohsiung, Taiwan
fYear :
2011
fDate :
3-8 July 2011
Firstpage :
1315
Lastpage :
1318
Abstract :
This paper introduces an antenna design based on MCM-D manufacturing technology to realize an antenna-integrated package for IEEE 802.11b/g application. Co-design guidelines are employed to include the parasitic effects caused by the integration of the antenna and the RF module. The loop antenna is located on the second layer of the MCM-D substrate. The antenna incorporates the capacitively feed strip which is fed by the coplanar waveguide (CPW). By the coupling feed technique, the size of the proposed antenna is only 3.8 mm × 4.7 mm over the WLAN band (2.4-2.484 GHz). Furthermore, the resonant frequency can be adjusted by tuning the length of the coupling strip. The results show that the coupling-fed loop antenna achieved a gain of 1.6 dBi and radiation efficiency of 85 % at 2.45 GHz in a very compact size (0.03 λ0 × 0.04 λ0). In addition, the occupied area of the antenna is very small (4.4%) compared to the overall area of the package; therefore, the proposed method is very useful for package antenna design. The detailed parameters studies are presented, which demonstrate the feasibility of the proposed method.
Keywords :
coplanar waveguides; loop antennas; multichip modules; strip line couplers; system-in-package; wireless LAN; IEEE 802.11b/g; MCM-D manufacturing technology; RF module; WLAN; antenna integrated package; co-design guidelines; coplanar waveguide; coupling strip; loop antenna; package antenna design; parasitic effects; resonant frequency; Antenna feeds; Coplanar waveguides; Couplings; Propagation losses; Resonant frequency; Antenna-integrated package; MCM-D manufacturing; coupling-fed antenna;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation (APSURSI), 2011 IEEE International Symposium on
Conference_Location :
Spokane, WA
ISSN :
1522-3965
Print_ISBN :
978-1-4244-9562-7
Type :
conf
DOI :
10.1109/APS.2011.5996531
Filename :
5996531
Link To Document :
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