Title :
Non-Fickian moisture properties characterisation and diffusion modeling for electronic packages
Author :
Wong, E.H. ; Chan, K.C. ; Lim, T.B. ; Lam, T.F.
Author_Institution :
Inst. of Microelectron., Singapore
Abstract :
The rate of moisture diffusion in the IC packaging materials was found to be dependent not only on the concentration gradient as described by Fick´s Law, but also on the moisture concentration itself. This non-Fickian behaviour poses a challenge for the characterisation of moisture diffusivity of packaging materials which is conventionally based on Fick´s diffusion law. This paper presents an integrated non-linear finite element diffusion modeling and optimisation procedure that is capable of characterising moisture diffusivity as a function of moisture concentration from a single moisture sorption experiment
Keywords :
diffusion; finite element analysis; integrated circuit packaging; modelling; moisture; optimisation; Fick diffusion law; IC packaging materials; concentration gradient; diffusion modeling; electronic packages; integrated nonlinear FE diffusion modeling/optimisation procedure; moisture concentration; moisture diffusivity; moisture sorption experiment; non-Fickian moisture properties characterisation; nonFickian behaviour; nonlinear finite element modeling; packaging materials; Biomembranes; Electronics packaging; Microelectronics; Moisture measurement; Performance analysis; Plastic packaging; Shape measurement; Temperature; Thermal stresses; Time measurement;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776189
