Title :
Study of FeCo-SiO2 Granular Films for High Frequency Application
Author :
Ge, S. ; Yao, D. ; Kim, K. ; Yang, X. ; Xi, L. ; Li, B.
Author_Institution :
Lanzhou Univ., Lanzhou
Abstract :
In this work, Fe65Co35 alloy which has maximum saturation magnetization (Ms) among all metal magnetic materials was chosen to make Fe65Co35-SiO2 granular films, and the magnetic properties in whole composition were studied. The results show that good high frequency soft magnetic films were obtained by carefully controlling the microstructure. A serious (Fe65Co35)x(SiO2)1-x granular films are fabricated by RF magnetron co-sputtering. X-ray diffraction shows that all samples have bcc structure of Fe65Co35 alloys. Transmission electronic microscope (TEM) image and the corresponding electronic diffraction (ED) pattern for a typical sample of x = 0.57 show that the sample consists of bcc Fe65Co35 particles embedded uniformly in insulating SiO2 matrix. Magnetic hysteresis loops measured by vibrating sample magnetometer (VSM) shows that the samples have in plane uniaxial anisotropy, and anisotropy field is around 60 Oe.
Keywords :
X-ray diffraction; cobalt alloys; crystal structure; electron diffraction; granular materials; high-frequency effects; iron alloys; magnetic anisotropy; magnetic hysteresis; magnetic thin films; metallic thin films; silicon compounds; soft magnetic materials; sputter deposition; transmission electron microscopy; ED; Fe65Co35-SiO2; RF magnetron co-sputtering; TEM; VSM; X-ray diffraction; alloy granular films; bcc structure; electronic diffraction; high frequency soft magnetic films; magnetic hysteresis loops; metal magnetic materials; microstructure; saturation magnetization; transmission electronic microscopy; uniaxial anisotropy; vibrating sample magnetometer; Anisotropic magnetoresistance; Cobalt alloys; Frequency; Iron alloys; Magnetic films; Magnetic materials; Magnetic properties; Microstructure; Saturation magnetization; X-ray diffraction;
Conference_Titel :
Magnetics Conference, 2006. INTERMAG 2006. IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-1479-2
DOI :
10.1109/INTMAG.2006.375631