Development of a 1000-pin fine-pitch BGA for high performance LSI

Author

Suwa, Motoo ; Miwa, Takashi ; Tsutsumi, Yasumi ; Shirai, Yuji

Author_Institution

Device Dev. Center, Hitachi Ltd., Tokyo, Japan

fYear

1999

fDate

1999

Firstpage

430

Lastpage

434

Abstract

A 1000-pin fine-pitch BGA has been developed by using a 50-μm ultra fine pitch wire bonding technique. This package can be mounted with a chip with dimensions ranging from 14 mm×14 mm to 16 mm×16 mm. This package also has signal lines that have an embedded microstrip line structure. Also it has a package size heat spreader, which means that the electrical characteristics are such that the package can be applied to an LSI operating at a frequency of about 800 MHz. The thermal characteristics are such that the package can be applied to 10 W devices without the need for a fin. Furthermore, this BGA package has been confirmed to be sufficiently reliable

Keywords

ball grid arrays; fine-pitch technology; high-speed integrated circuits; integrated circuit packaging; large scale integration; lead bonding; 10 W; 1000-pin configuration; 14 mm; 16 mm; 50 micron; 800 MHz; embedded microstrip line structure; fine-pitch BGA; high performance LSI; package size heat spreader; thermal characteristics; ultra fine pitch wire bonding technique; Assembly; Bonding; Electronics packaging; Large scale integration; Lead; Pins; Resistance heating; Voltage; Wire; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

0-7803-5231-9

Type

conf

DOI

10.1109/ECTC.1999.776210

Filename

776210