Title :
Experimental evaluation of effect of global to local interaction on HDI solder joint deformation
Author :
Lu, Hua ; Yeh, Chao-pin ; Dai, Jiabin
Author_Institution :
Software Technol. Center, Motorola Inc., Schaumburg, IL, USA
Abstract :
This paper study the solder joint thermal-mechanical deformation in a CSP affected by the remote constrains of the chip carrier. A novel digital speckle correlation is applied to directly measure solder joint shear strain without having to section the sample, and a phase shifting shadow moire is employed in obtaining warpage of the HDI substrate. Analysis is made based on the experimental findings, which suggests that the higher level constraints play a large part in solder joint deformation
Keywords :
chip scale packaging; chip-on-board packaging; deformation; flip-chip devices; integrated circuit interconnections; moire fringes; soldering; speckle; CSP; HDI substrate warpage; chip carrier; digital speckle correlation; flip-chip-on-board; phase shifting shadow moire; shear strain measurement; solder joint; thermal-mechanical deformation; Aluminum; Assembly; Chaos; Chip scale packaging; Heat sinks; Integrated circuit interconnections; Semiconductor device measurement; Soldering; Strain measurement; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776217
