Title :
Design issues with high speed logic
Author :
Wyland, David C.
Author_Institution :
The Wyland Group, Morgan Hill, CA, USA
Abstract :
Faster CPU´s have put a strain on the ability of glue logic to support them. The old method of just making the glue logic faster doesn´t work anymore. This problem has generated new solutions in the form of innovative analog design applied to digital applications. This paper explores one of these innovations, the Ultra Fast Buffer
Keywords :
buffer circuits; integrated logic circuits; logic design; high speed logic; ultra fast buffer; Acoustic reflection; Application software; Capacitive sensors; Clocks; Costs; Delay effects; Frequency; Logic design; Noise generators; Timing;
Conference_Titel :
WESCON/94. Idea/Microelectronics. Conference Record
Conference_Location :
Anaheim , CA
Print_ISBN :
0-7803-9992-7
DOI :
10.1109/WESCON.1994.403526
