DocumentCode
2935956
Title
Industry acceptance of boundary scan
Author
Hronik, Stanley
Author_Institution
Integrated Device Technol. Inc., Santa Clara, CA, USA
fYear
1994
fDate
27-29 Sep 1994
Firstpage
518
Lastpage
524
Abstract
Boundary-scan has been a published standard since May 21, 1990. Since inception of the standard, several manufacturers have introduced boundary-scan methods and are actively building systems. In order to determine the success of boundary-scan in penetrating the marketplace, a survey was conducted which covered several key points. The survey was designed to determine the need for a test method like boundary-scan, to determine how well boundary-scan meets those needs, and to make projections on how well boundary-scan will develop in the future. Thirty three engineers were polled in the survey, with each representing a different company in the United States or Canada. All respondents were active in design work, component qualification, or system testing. While the sample size was small, trends were observed which indicated validity of the data. The results show that boundary-scan is entering segments of the testing arena, but acceptance is slow and not universal. The conditions examined include the following: 1) How important is system testing in the eyes of system manufacturers? Aspects of testing that were examined included success rates, cost of testing, and test methods used. 2) What are the testing needs of industry? How rapidly is the industry moving to fine pitch modules and components that are not easily tested with probing techniques? What are the failure mechanisms. 3) Does boundary-scan meet the testing needs? What are boundary scan shortcomings, cost issues, and testing effectiveness? 4) Is boundary-scan in the development plans of designers and test engineers?
Keywords
automatic testing; boundary scan testing; failure analysis; fine-pitch technology; printed circuit testing; production testing; ATE; PCB testing; boundary scan; cost of testing; failure mechanisms; fine pitch modules; probing techniques; published standard; system testing; test method; testing effectiveness; Buildings; Costs; Design engineering; Eyes; Failure analysis; Fault detection; Manufacturing industries; Qualifications; Standards publication; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
WESCON/94. Idea/Microelectronics. Conference Record
Conference_Location
Anaheim , CA
ISSN
1095-791X
Print_ISBN
0-7803-9992-7
Type
conf
DOI
10.1109/WESCON.1994.403545
Filename
403545
Link To Document