• DocumentCode
    2935956
  • Title

    Industry acceptance of boundary scan

  • Author

    Hronik, Stanley

  • Author_Institution
    Integrated Device Technol. Inc., Santa Clara, CA, USA
  • fYear
    1994
  • fDate
    27-29 Sep 1994
  • Firstpage
    518
  • Lastpage
    524
  • Abstract
    Boundary-scan has been a published standard since May 21, 1990. Since inception of the standard, several manufacturers have introduced boundary-scan methods and are actively building systems. In order to determine the success of boundary-scan in penetrating the marketplace, a survey was conducted which covered several key points. The survey was designed to determine the need for a test method like boundary-scan, to determine how well boundary-scan meets those needs, and to make projections on how well boundary-scan will develop in the future. Thirty three engineers were polled in the survey, with each representing a different company in the United States or Canada. All respondents were active in design work, component qualification, or system testing. While the sample size was small, trends were observed which indicated validity of the data. The results show that boundary-scan is entering segments of the testing arena, but acceptance is slow and not universal. The conditions examined include the following: 1) How important is system testing in the eyes of system manufacturers? Aspects of testing that were examined included success rates, cost of testing, and test methods used. 2) What are the testing needs of industry? How rapidly is the industry moving to fine pitch modules and components that are not easily tested with probing techniques? What are the failure mechanisms. 3) Does boundary-scan meet the testing needs? What are boundary scan shortcomings, cost issues, and testing effectiveness? 4) Is boundary-scan in the development plans of designers and test engineers?
  • Keywords
    automatic testing; boundary scan testing; failure analysis; fine-pitch technology; printed circuit testing; production testing; ATE; PCB testing; boundary scan; cost of testing; failure mechanisms; fine pitch modules; probing techniques; published standard; system testing; test method; testing effectiveness; Buildings; Costs; Design engineering; Eyes; Failure analysis; Fault detection; Manufacturing industries; Qualifications; Standards publication; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    WESCON/94. Idea/Microelectronics. Conference Record
  • Conference_Location
    Anaheim , CA
  • ISSN
    1095-791X
  • Print_ISBN
    0-7803-9992-7
  • Type

    conf

  • DOI
    10.1109/WESCON.1994.403545
  • Filename
    403545