DocumentCode
2936129
Title
A high density multichip module for 2.48 Gb/s ATM switching system
Author
Ju, Chul-Won ; Lee, Youngmin ; Lee, Sang-Pok ; Park, Seong-Su ; Song, Min Kyu
Author_Institution
ETRI, Micro-Electron. Technol. Lab., Taejon, South Korea
fYear
1999
fDate
1999
Firstpage
676
Lastpage
679
Abstract
We have developed a new MCM of 16×16 ATM switching elements handling a total signal throughput of 2.48 Gb/s by routing 16 trunk lines of 155 Mbps. This paper will describe the Cu/BCB multilayer process, basic electrical properties of MCM-D interconnect, MCM features in terms of specifications, structure, and assembly and module functional test
Keywords
B-ISDN; asynchronous transfer mode; integrated circuit interconnections; integrated circuit packaging; multichip modules; telecommunication network routing; 2.48 Gbit/s; ATM switching system; MCM-D interconnect; assembly; electrical properties; high density multichip module; module functional test; multilayer process; total signal throughput; trunk line routing; Assembly; Asynchronous transfer mode; Communication switching; Dielectric substrates; Multichip modules; Nonhomogeneous media; Propagation delay; Switches; Switching systems; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
0-7803-5231-9
Type
conf
DOI
10.1109/ECTC.1999.776252
Filename
776252
Link To Document