Title :
Packaging 1000 MIPS for IBM´s S/390 G5 server
Author :
Katopis, G.A. ; Backer, W.D. ; Mazzawy, T. ; Stoller, H.
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
Abstract :
The new Enterprise model for the S/390 G5 system achieves an off-chip bus speed of 300 MHz using for the first level package a glass ceramic multichip module (MCM) with full field thin film wiring consisting of six polyimide layers and containing a plane pair of signal wiring. A description of the physical attributes of this substrate is presented. In addition, the crucial physical design procedure required for the successful wiring of this MCM is highlighted. Finally, the resulting electrical characteristics of this MCM are summarized
Keywords :
IBM computers; ceramic packaging; multichip modules; network servers; wiring; 1000 MIPS; 300 MHz; Enterprise model; IBM S/390 G5 server; electrical characteristics; first level package; full field thin film wiring; glass ceramic multichip module; off-chip bus speed; physical attributes; physical design procedure; plane pair; polyimide layers; signal wiring; CMOS technology; Ceramics; Glass; Packaging; Polyimides; Substrates; Switches; System performance; Transistors; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776253
