A study of delamination growth in the die-attach layer of plastic IC packages under hygrothermal loading during solder reflow

Author

Tay, A.A.O. ; Goh, K.Y.

Author_Institution

Centre for IC Failure Analysis & Reliability, Nat. Univ. of Singapore, Singapore

fYear

1999

fDate

1999

Firstpage

694

Lastpage

701

Abstract

This paper describes a comprehensive numerical study of the effects of many parameters on the propagation of delaminations in the die-attach layer using a finite element linear elastic fracture mechanics approach. The parameters investigated include the coefficient of thermal expansion (CTE) of the die-attach material, the thickness of the die-attach layer, the CTE of the pad material and the location and size of the initial delaminations (defects). The effect of the pressure of water vapor at the delamination was also investigated

Keywords

delamination; environmental degradation; finite element analysis; fracture mechanics; humidity; integrated circuit packaging; microassembling; plastic packaging; reflow soldering; thermal expansion; coefficient of thermal expansion; delamination; die attach layer; finite element linear elastic fracture mechanics; hygrothermal loading; plastic IC package; solder reflow; water vapor pressure; Delamination; Failure analysis; Finite element methods; Moisture; Plastic integrated circuit packaging; Plastic packaging; Reflow soldering; Thermal expansion; Thermal factors; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

0-7803-5231-9

Type

conf

DOI

10.1109/ECTC.1999.776255

Filename

776255