DocumentCode :
2936254
Title :
Oxide adhesion characteristic of lead frame copper alloys
Author :
Tomioka, Yoichi ; Miyake, Jun
Author_Institution :
Nippon Mining and Metals Co., Ltd.
fYear :
1999
fDate :
1-4 June 1999
Firstpage :
714
Lastpage :
720
Keywords :
Adhesives; Conductive films; Copper alloys; Delamination; Electromagnetic compatibility; Lead compounds; Plastic packaging; Reflow soldering; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA, USA
ISSN :
0569-5503
Print_ISBN :
0-7803-5231-9
Type :
conf
DOI :
10.1109/ECTC.1999.776258
Filename :
776258
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2936254
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