Adhesion enhancement of Pd plated leadframes

Author

Cui, C.Q. ; Tay, H.L. ; Chai, T.C.

Author_Institution

Inst. of Microelectron., Singapore

fYear

1999

fDate

1999

Firstpage

837

Lastpage

841

Abstract

A surface treatment method for Pd plated leadframes to improve its adhesion to die attach materials and mold compounds is developed. It was found that regardless of the structures of Pd plated leadframes, the adhesion could be increased by up to ten times, compared with untreated Pd plated leadframes. With the improved adhesion, TQFP100 packages with the treated Pd leadframes passed the JEDEC Level 1 in moisture sensitivity test and 1000 cycles in thermal cycling without any delamination. In contrast, severe interfacial delamination was found in JEDEC Level 3 moisture sensitivity test, or after 100 cycles in thermal cycling for all of TQFP 100 packages with pristine Pd leadframes. In addition, the wire bondability of treated Pd leadframe is shown to be compatible with the packaging assembly process

Keywords

adhesion; delamination; integrated circuit packaging; integrated circuit reliability; lead bonding; moisture; palladium; surface treatment; JEDEC Level 1 in moisture sensitivity test; Pd; Pd plated leadframes; TQFP100 packages; adhesion enhancement; delamination; die attach materials; mold compounds; packaging assembly process; surface treatment method; thermal cycling; wire bondability; Adhesives; Assembly; Bonding; Delamination; Microassembly; Moisture; Packaging; Surface treatment; Testing; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

0-7803-5231-9

Type

conf

DOI

10.1109/ECTC.1999.776279

Filename

776279