Title :
Electrical modeling of RFIC packages up to 12 GHz
Author :
Horng, T.S. ; Wu, S.-M. ; Shih, C.
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
In this paper, a broadband vector-network-analyzer (VNA) measurement technique is developed to establish the equivalent circuits for RFIC (Radio-Frequency Integrated Circuit) packages up to 12 GHz. The models can be used to evaluate various package effects, such as resonance, coupling, impedance mismatch and frequency-dependent losses, at higher microwave frequencies. The research takes up measurement of the two-port scattering parameters for any pair of coupled traces, from which an equivalent coupled lumped model can be extracted. Then a step-by-step optimization scheme is employed to construct the complete equivalent circuits for the packages, which can be used in the SPICE simulator to perform the signal integrity analysis in RFIC designs. A real example on electrical modeling of a TSSOP16 package has been demonstrated
Keywords :
MMIC; S-parameters; UHF integrated circuits; electric impedance; equivalent circuits; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; losses; microwave measurement; network analysers; resonance; 12 GHz; RFIC design; RFIC packages; SPICE simulator; TSSOP16 package; broadband VNA measurement technique; coupling; electrical modeling; equivalent circuits; equivalent coupled lumped model; frequency-dependent losses; impedance mismatch; microwave frequencies; optimization scheme; package effects; radiofrequency integrated circuit; resonance; signal integrity analysis; two-port scattering parameters; vector network analyzer measurement; Coupling circuits; Equivalent circuits; Impedance; Integrated circuit measurements; Integrated circuit packaging; Measurement techniques; Microwave frequencies; Radiofrequency integrated circuits; Resonance; Scattering parameters;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776284