Title :
The needs, evolution, status and challenges of microelectronics packaging education in the US
Author :
Tummala, Rao ; Conrad, Leyla ; May, Gary
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
It is only within the last 10 years that packaging has begun to be viewed as an important discipline. Several universities have started to provide packaging courses as well as special focuses on certificate programs. This paper describes human resource needs in terms of quality and quantity of packaging engineers, the evolution of electronic packaging education at all levels in the US to meet these human resource needs, and discusses how the next generation of microelectronics packaging education should be conducted to meet the needs of US industry
Keywords :
educational courses; electronic engineering education; human factors; integrated circuit packaging; US universities; USA; certificate programs; human resource needs; microelectronics packaging; packaging courses; packaging education; packaging engineers; Consumer electronics; Educational institutions; Educational programs; Educational technology; Electronics industry; Electronics packaging; Humans; Manufacturing industries; Microelectronics; Semiconductor device packaging;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776287
