DocumentCode :
2937066
Title :
Magnetic and microstructural properties of thick sputtered NdFeB films.
Author :
Walther, A. ; Khlopkov, K. ; May, F. ; Dempsey, N. ; Gutfleisch, O.
Author_Institution :
CNRS, Grenoble
fYear :
2006
fDate :
8-12 May 2006
Firstpage :
223
Lastpage :
223
Abstract :
Thick NdFeB films have been prepared by triode sputtering with a deposition rate of 20 mum/hour. Films were deposited on either "cool" substrates or onto substrates heated in the range 300-500degC and then annealed at 750degC for 10 minutes. Magnetic characterisation was carried out at room temperature with an extraction magnetometer in fields of up to 10 T. Microstructures were observed with a LEO field emission gun FEG-SEM. The degree of magnetic texture of the annealed films and microstructure was found to depend on the substrate temperature. The observed grain refinement to the precipitation during deposition of nanocrystals of NdFeB which act as nucleation sites during post-deposition annealing. Thick film hard magnets are required for application in magnetic MEMS. The microstructural analysis is necessary for the understanding and thus the optimisation of the magnetic properties of such thick film magnets.
Keywords :
annealing; boron alloys; coercive force; ferromagnetic materials; grain refinement; iron alloys; magnetic thin films; metallic thin films; nanostructured materials; neodymium alloys; nucleation; permanent magnets; precipitation; scanning electron microscopy; sputtered coatings; texture; LEO field emission gun FEG-SEM; NdFeB; annealing; grain refinement; magnetic properties; magnetic texture; magnetometer; microstructural properties; nanocrystals; nucleation; precipitation; temperature 293 K to 298 K; temperature 300 C to 500 C; temperature 750 C; thick film hard magnets; time 10 min; triode sputtering; Annealing; Magnetic films; Magnetic properties; Magnetometers; Magnets; Microstructure; Sputtering; Substrates; Temperature; Thick films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Magnetics Conference, 2006. INTERMAG 2006. IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-1479-2
Type :
conf
DOI :
10.1109/INTMAG.2006.375805
Filename :
4261656
Link To Document :
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