Title :
Detection of defects in ceramic substrate with embedded passive components by scanning acoustic microscopy
Author :
Yu, Z.Q. ; Li, G.Y. ; Cha, Y.C.
Author_Institution :
Dept. of Electron. Eng., City Univ. of Hong Kong, Kowloon, Hong Kong
Abstract :
Delaminations of the embedded passive components are often associated with reliability problems. Understanding the delamination can help us quickly identify the failure cause at an early stage of the failure analysis. In this work, defects of buried capacitors have been detected by use of scanning acoustic microscopy (SAM). The results show that SAM can be a powerful analytical tool for the nondestructive evaluation of delaminations in buried passive components. T-scan is an effective method for determining the existence of the internal defects, and TAMI-scan is shown to be capable of detecting the location and size of the delamination and void
Keywords :
acoustic microscopy; capacitors; ceramic packaging; circuit reliability; delamination; failure analysis; flaw detection; hybrid integrated circuits; integrated circuit packaging; integrated circuit reliability; multichip modules; substrates; voids (solid); SAM; T-scan method; TAMI-scan method; buried capacitors; buried passive components; ceramic substrate; defects detection; delaminations; electronic packages; embedded passive components; failure analysis; internal defects; nondestructive evaluation; reliability problems; scanning acoustic microscopy; void location; void size; Acoustic pulses; Acoustic signal detection; Capacitors; Ceramics; Delamination; Microscopy; Packaging; Testing; Ultrasonic imaging; Ultrasonic transducers;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776312
