• DocumentCode
    2937483
  • Title

    SIMMWICs on Micromachined Silicon on Insulator Substrates Beyond 100 GHz

  • Author

    Müller, Andreas ; Kasper, Erich

  • Author_Institution
    Robert Bosch GmbH, Ditzingen
  • fYear
    2008
  • fDate
    23-25 Jan. 2008
  • Firstpage
    22
  • Lastpage
    29
  • Abstract
    The realization of SIMMWICs (silicon millimeter-wave integrated circuits) for frequencies above 100 GHz is presented. Epitaxial layers grown with molecular beam epitaxy and low-loss microstrip lines allow the implementation of a variety of devices required for basic system-on-chip building blocks. The applied silicon technology using Al/AlNiSi contacts offers excellent integration possibilities. Schottky diodes are designed for Mott mode operation and feature cutoff-frequencies of more than 700 GHz. Substrate membranes with a thickness of 50 mum are created by applying a selective etching process using silicon on insulator (SOI) wafers. Different microstrip circuit designs demonstrate the integration potential. Finally, two singly balanced mixer designs with low LO-power drive demands and low conversion loss characteristics are exposed. We choose the 122 GHz ISM band as an example for the demonstration of the potential of this cost-effective integration approach.
  • Keywords
    Schottky diodes; micromachining; microstrip lines; millimetre wave devices; molecular beams; silicon-on-insulator; system-on-chip; SIMMWIC; Schottky diodes; low-loss microstrip lines; micromachined silicon on insulator substrates; molecular beam epitaxy; silicon millimeter-wave integrated circuits; system-on-chip; Epitaxial layers; Frequency; Integrated circuit technology; Microstrip; Millimeter wave integrated circuits; Molecular beam epitaxial growth; Schottky diodes; Silicon on insulator technology; Substrates; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon Monolithic Integrated Circuits in RF Systems, 2008. SiRF 2008. IEEE Topical Meeting on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4244-1855-8
  • Electronic_ISBN
    978-1-4244-1856-5
  • Type

    conf

  • DOI
    10.1109/SMIC.2008.13
  • Filename
    4446247