Title :
Structural design system for thermally enhanced LSI packages
Author :
Yoneda, Nae ; Kitano, Makoto ; Miura, Hideo ; Shimizu, Ichio ; Koike, Nobuya
Author_Institution :
Mech. Eng. Res. Lab., Hitachi Ltd., Ibaraki, Japan
Abstract :
A program practical that enables design engineers to simply design thermal resistance of IC packages has been developed. Template solid models of IC packages and an automatic system for determining heat transfer coefficient are included in the program. The program does not require the design engineers to have a special knowledge of thermal analysis, and it runs on a personal computer with a 200-MHz PowerPC 604 using 13 MB of RAM. It takes only about 10 seconds to calculate thermal resistance of a quad flat package (QFP) mounted on a printed circuit board (PCB). The error between the calculated and measured values was confirmed to be within about ±20% by 144-case investigations. A thermally enhanced QFP with a heat spreader (JEDEC code: MO-204) has been developed using this program
Keywords :
electronic design automation; integrated circuit packaging; large scale integration; solid modelling; thermal management (packaging); thermal resistance; IC package; LSI; automatic system; heat spreader; heat transfer coefficient; personal computer; printed circuit board; quad flat package; structural design; template solid model; thermal enhancement; thermal resistance; Design engineering; Electronics packaging; Heat transfer; Integrated circuit modeling; Integrated circuit packaging; Large scale integration; Power system modeling; Solid modeling; Thermal engineering; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-5231-9
DOI :
10.1109/ECTC.1999.776325
