DocumentCode :
2937611
Title :
The effect of copper foil properties on low cycle fatigue of a multi-layer flex cable
Author :
Farquhar, Donald S. ; Niu, Tyan M. ; Keesler, Ross ; Bupp, James R.
Author_Institution :
IBM Microelectron., Endicott, NY, USA
fYear :
1999
fDate :
1999
Firstpage :
1116
Lastpage :
1121
Abstract :
A multi-layer high performance flex cable was used as a test vehicle for studying the effect of copper foil properties on low cycle fatigue properties of fine line conductors. We fabricated the cable using copper foils for the three conductor layers, and used advanced organic composite dielectric materials for the internal dielectric layers. We fabricated the conductors using subtractive etching as opposed to using an additive plating process. The cable had to survive multiple cycles of fatigue bending around a sharp radius and we found that selection of copper foil was critical in determining fatigue life. We identified three distinct failure mechanisms in the cables that depended strongly on the surface roughness of the foil. We then studied the mechanical properties of free-standing copper foils of varying roughness and thickness to explain the behavior of the cables. We found that the surface roughness of the foils, and the ratio of roughness to thickness, strongly effected their fatigue performance
Keywords :
bending; cable testing; cables (electric); etching; fatigue; foils; surface topography; Cu; failure mechanisms; fatigue bending; fatigue life; fine line conductors; foil properties; internal dielectric layers; low cycle fatigue properties; multi-layer flex cable; organic composite dielectric materials; subtractive etching; surface roughness; test vehicle; Cables; Conducting materials; Copper; Dielectric materials; Etching; Fatigue; Rough surfaces; Surface roughness; Testing; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
0-7803-5231-9
Type :
conf
DOI :
10.1109/ECTC.1999.776329
Filename :
776329
Link To Document :
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