• DocumentCode
    2937657
  • Title

    Influence of Substrate Parasitic Effects on Power Gain Relation Between CE and CB SiGe HBTs

  • Author

    Huang, Hai ; Ma, Zhenqiang ; Ma, Pingxi ; Rananelli, Marco

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Wisconsin-Madison, Madison, WI
  • fYear
    2008
  • fDate
    23-25 Jan. 2008
  • Firstpage
    62
  • Lastpage
    65
  • Abstract
    The impact of substrate parasitic effects on the power gain relation between the CE and CB configurations of low-power SiGe HBTs has been analyzed. In comparison to large-area power SiGe HBTs, the speed and small-signal power gain of the device are much higher. Nevertheless, the relative parasitic effects on these small devices are much stronger than that on the large ones. It is found that due to the influence of substrate parasitic effects (input and output coupling between input and output pads), the power gain of CB SiGe HBTs can be dramatically degraded, while the power gain of CE SiGe HBTs is not affected much. The consequence of the different influences of parasitic effects on CE and CB SiGe HBTs is that the intrinsic higher power gain of the CB SiGe HBT than the CE device is lost, which is verified by measurements. Based on the detailed analysis of the substrate parasitic effects, an approach to restoring the superior power gain characteristics of CB SiGe HBTs is proposed.
  • Keywords
    Ge-Si alloys; heterojunction bipolar transistors; substrates; CB SiGe HBT; CE SiGe HBT; SiGe; power gain relation; substrate parasitic effects; Cutoff frequency; Degradation; Fingers; Gain measurement; Germanium silicon alloys; Heterojunction bipolar transistors; Power generation; Power measurement; Silicon germanium; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon Monolithic Integrated Circuits in RF Systems, 2008. SiRF 2008. IEEE Topical Meeting on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    978-1-4244-1855-8
  • Electronic_ISBN
    978-1-4244-1856-5
  • Type

    conf

  • DOI
    10.1109/SMIC.2008.22
  • Filename
    4446256