DocumentCode
2937733
Title
High reliability pre-mold package with optical fiber guide pipe
Author
Tanahashi, Shigeo ; Matsubara, Takahiro
Author_Institution
R&D Centre Keihanna, KYOCERA Corp., Kyoto, Japan
fYear
1999
fDate
1999
Firstpage
1156
Lastpage
1158
Abstract
A pre-mold package with optical fiber guide pipe has been developed to supply the low cost package for the access network systems market. This paper describes the PD module utilizing the premold package which has a very low variation of dark current after the reliability test. It is very close to that of TO-CAN type PD. In this paper, we propose the premold package to meet the market requirements offering low cost and high reliability solution
Keywords
modules; photodiodes; semiconductor device packaging; semiconductor device reliability; PD module; access network systems; cost; dark current; optical fiber guide pipe; pre-mold package; reliability; Capacitance measurement; Ceramics; Costs; Dark current; Electronics packaging; Lead; Optical fibers; Organic materials; Resins; Telecommunication network reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
0-7803-5231-9
Type
conf
DOI
10.1109/ECTC.1999.776338
Filename
776338
Link To Document