• DocumentCode
    2937749
  • Title

    Post-weld-shift in semiconductor laser packaging

  • Author

    Wang, S.C. ; Chan, Hian L. ; Wang, C. ; Wan, C.M. ; Liaw, J.W. ; Sheen, M.T. ; Kuang, J.H. ; Chien, C.P. ; Wang, G.L. ; Cheng, W.H.

  • Author_Institution
    Chunghwa Telecom Labs., Taoyuan, Taiwan
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    1159
  • Lastpage
    1163
  • Abstract
    Post-weld-shift (PWS) in laser welding technique for a package (DIP) with fiber pigtail to laser connection has been studied experimentally and numerically modelled. Experimental results show that the PWS of optical component welded by a dual-beam laser welding system shifts more to the counterclockwise as the energy difference of the laser beam increases. This indicates that the PWS in laser packaging can be minimized by properly controlling the laser beam energy delivery. A finite-element method (FEM) has been carried out to analyse the effect of laser beam energy variation on PWS in laser packaging. A satisfactory agreement between the experimental results and FEM calculations suggests that the FEM provides one of the effective methods for predicting the PWS in laser welding technique for optoelectronic packaging
  • Keywords
    finite element analysis; laser beam welding; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; PWS; dual-beam laser welding system; energy difference; fiber pigtail to laser connection; finite-element method; laser beam energy delivery; laser beam energy variation; optoelectronic packaging; post-weld-shift; semiconductor laser packaging; Electronics packaging; Fiber lasers; Laser beams; Laser modes; Numerical models; Optical control; Optical devices; Semiconductor device packaging; Semiconductor lasers; Welding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-5231-9
  • Type

    conf

  • DOI
    10.1109/ECTC.1999.776339
  • Filename
    776339