DocumentCode :
2937749
Title :
Post-weld-shift in semiconductor laser packaging
Author :
Wang, S.C. ; Chan, Hian L. ; Wang, C. ; Wan, C.M. ; Liaw, J.W. ; Sheen, M.T. ; Kuang, J.H. ; Chien, C.P. ; Wang, G.L. ; Cheng, W.H.
Author_Institution :
Chunghwa Telecom Labs., Taoyuan, Taiwan
fYear :
1999
fDate :
1999
Firstpage :
1159
Lastpage :
1163
Abstract :
Post-weld-shift (PWS) in laser welding technique for a package (DIP) with fiber pigtail to laser connection has been studied experimentally and numerically modelled. Experimental results show that the PWS of optical component welded by a dual-beam laser welding system shifts more to the counterclockwise as the energy difference of the laser beam increases. This indicates that the PWS in laser packaging can be minimized by properly controlling the laser beam energy delivery. A finite-element method (FEM) has been carried out to analyse the effect of laser beam energy variation on PWS in laser packaging. A satisfactory agreement between the experimental results and FEM calculations suggests that the FEM provides one of the effective methods for predicting the PWS in laser welding technique for optoelectronic packaging
Keywords :
finite element analysis; laser beam welding; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; PWS; dual-beam laser welding system; energy difference; fiber pigtail to laser connection; finite-element method; laser beam energy delivery; laser beam energy variation; optoelectronic packaging; post-weld-shift; semiconductor laser packaging; Electronics packaging; Fiber lasers; Laser beams; Laser modes; Numerical models; Optical control; Optical devices; Semiconductor device packaging; Semiconductor lasers; Welding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
0-7803-5231-9
Type :
conf
DOI :
10.1109/ECTC.1999.776339
Filename :
776339
Link To Document :
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