DocumentCode
2937749
Title
Post-weld-shift in semiconductor laser packaging
Author
Wang, S.C. ; Chan, Hian L. ; Wang, C. ; Wan, C.M. ; Liaw, J.W. ; Sheen, M.T. ; Kuang, J.H. ; Chien, C.P. ; Wang, G.L. ; Cheng, W.H.
Author_Institution
Chunghwa Telecom Labs., Taoyuan, Taiwan
fYear
1999
fDate
1999
Firstpage
1159
Lastpage
1163
Abstract
Post-weld-shift (PWS) in laser welding technique for a package (DIP) with fiber pigtail to laser connection has been studied experimentally and numerically modelled. Experimental results show that the PWS of optical component welded by a dual-beam laser welding system shifts more to the counterclockwise as the energy difference of the laser beam increases. This indicates that the PWS in laser packaging can be minimized by properly controlling the laser beam energy delivery. A finite-element method (FEM) has been carried out to analyse the effect of laser beam energy variation on PWS in laser packaging. A satisfactory agreement between the experimental results and FEM calculations suggests that the FEM provides one of the effective methods for predicting the PWS in laser welding technique for optoelectronic packaging
Keywords
finite element analysis; laser beam welding; semiconductor device packaging; semiconductor device reliability; semiconductor lasers; PWS; dual-beam laser welding system; energy difference; fiber pigtail to laser connection; finite-element method; laser beam energy delivery; laser beam energy variation; optoelectronic packaging; post-weld-shift; semiconductor laser packaging; Electronics packaging; Fiber lasers; Laser beams; Laser modes; Numerical models; Optical control; Optical devices; Semiconductor device packaging; Semiconductor lasers; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
0-7803-5231-9
Type
conf
DOI
10.1109/ECTC.1999.776339
Filename
776339
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