DocumentCode :
2940192
Title :
A Heat Interaction Investigation in Thermally Assisted MRAM
Author :
Liu, Z. ; Han, G. ; Zheng, Y.
Author_Institution :
Data Storage Inst., Singapore
fYear :
2006
fDate :
8-12 May 2006
Firstpage :
393
Lastpage :
393
Abstract :
In this work, the heat interaction effect for adjacent cells is investigated. To simplify the process, five magnetic random access memory (MRAM) cells are chosen. All the cell sizes used here are in 100 nmtimes50 nm, but the distances between each other are changed (X-easy axis; Y-hard axis). The temperature rise is taken at the plane 5 nm above the heat elements for the central line across the three cells across the easy axis.
Keywords :
magnetic storage; random-access storage; easy axis; hard axis; heat interaction; magnetic random access memory cells; temperature rise; thermally assisted MRAM; Anisotropic magnetoresistance; Delay; Heating; Magnetic switching; Magnetization; Memory; Switches; Temperature distribution; Temperature sensors; Writing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Magnetics Conference, 2006. INTERMAG 2006. IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-1479-2
Type :
conf
DOI :
10.1109/INTMAG.2006.376117
Filename :
4261826
Link To Document :
بازگشت