DocumentCode
2940224
Title
Modelling and computing the electrical parameters of a multichip module interconnections
Author
Belahrach, Hassan ; Satar, Mouloud
Author_Institution
Fac. des Sci. et Tech., Ecole Royale de l´´Air, Marrakech
fYear
2008
fDate
20-22 July 2008
Firstpage
1
Lastpage
5
Abstract
In this paper, the network analog method is developed with a view to applying it to compute quasi-static electrical parameters (matrices of capacitance [Cij], inductance [Lij], conductance [Gij] and resistance [Rij]) of multilayer structures in CMOS technology. Finite-difference method with variable increments is applied to solve Laplacepsilas equation. It involves constructing a network analog having complex or real branches. Hence, if any advantages can be obtained, one may solve a network problem using the network analog method instead of the corresponding Laplacepsilas difference equations. Thus, the number of equations, the computational time and the memory space will be considerably reduced. Sample results are presented for conductor line sizes and spacing typical of multilevel VLSI structures.
Keywords
CMOS integrated circuits; Laplace equations; VLSI; finite difference methods; integrated circuit interconnections; CMOS technology; Laplace difference equations; capacitance; conductance; conductor line size; finite-difference method; inductance; memory space; multilevel VLSI structure; network analog method; quasi-static electrical parameter modelling; resistance; Analog computers; CMOS technology; Capacitance; Computer networks; Electric resistance; Finite difference methods; Inductance; Laplace equations; Multichip modules; Nonhomogeneous media; Electrical Parameters; Finite-Differences; Interconnections; Multilayer Substrates; Network Analog;
fLanguage
English
Publisher
ieee
Conference_Titel
Systems, Signals and Devices, 2008. IEEE SSD 2008. 5th International Multi-Conference on
Conference_Location
Amman
Print_ISBN
978-1-4244-2205-0
Electronic_ISBN
978-1-4244-2206-7
Type
conf
DOI
10.1109/SSD.2008.4632844
Filename
4632844
Link To Document