DocumentCode :
2940224
Title :
Modelling and computing the electrical parameters of a multichip module interconnections
Author :
Belahrach, Hassan ; Satar, Mouloud
Author_Institution :
Fac. des Sci. et Tech., Ecole Royale de l´´Air, Marrakech
fYear :
2008
fDate :
20-22 July 2008
Firstpage :
1
Lastpage :
5
Abstract :
In this paper, the network analog method is developed with a view to applying it to compute quasi-static electrical parameters (matrices of capacitance [Cij], inductance [Lij], conductance [Gij] and resistance [Rij]) of multilayer structures in CMOS technology. Finite-difference method with variable increments is applied to solve Laplacepsilas equation. It involves constructing a network analog having complex or real branches. Hence, if any advantages can be obtained, one may solve a network problem using the network analog method instead of the corresponding Laplacepsilas difference equations. Thus, the number of equations, the computational time and the memory space will be considerably reduced. Sample results are presented for conductor line sizes and spacing typical of multilevel VLSI structures.
Keywords :
CMOS integrated circuits; Laplace equations; VLSI; finite difference methods; integrated circuit interconnections; CMOS technology; Laplace difference equations; capacitance; conductance; conductor line size; finite-difference method; inductance; memory space; multilevel VLSI structure; network analog method; quasi-static electrical parameter modelling; resistance; Analog computers; CMOS technology; Capacitance; Computer networks; Electric resistance; Finite difference methods; Inductance; Laplace equations; Multichip modules; Nonhomogeneous media; Electrical Parameters; Finite-Differences; Interconnections; Multilayer Substrates; Network Analog;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Systems, Signals and Devices, 2008. IEEE SSD 2008. 5th International Multi-Conference on
Conference_Location :
Amman
Print_ISBN :
978-1-4244-2205-0
Electronic_ISBN :
978-1-4244-2206-7
Type :
conf
DOI :
10.1109/SSD.2008.4632844
Filename :
4632844
Link To Document :
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