Investigation of electromagnetic interferences caused by the stacked I/O connectors

This paper presented the investigations of the electromagnetic interferences (EMI) caused by the noises resulted from a common mode of stacked I/O connectors, which are analyzed using both numerical simulations and experimental measurements. The structures of stacked I/O connectors popularly exist on the printed circuit board (PCB) of today´s information technology equipments (ITE) for the purpose of reducing the sizes of equipments, from where it is observed that more size reduction will cause severer EMI. After the diagnosis and analysis, a strategy is presented to suppress the noise level as well as its emission, which is found to be very effective as shown in our examinations.