• DocumentCode
    2941237
  • Title

    Electrons and Holes Charging Current Peaks in Silicon Nanocrystals within SiO2 Layers Fabricated by Plasma Enhanced Chemical Vapor Deposition

  • Author

    Wang, X. ; Huang, R. ; Song, J. ; Guo, Y.Q. ; Chen, K.J. ; Li, W.

  • Author_Institution
    Dept. of Phys. & Electr. Eng., Hanshan Normal Univ., Chaozhou, China
  • fYear
    2010
  • fDate
    19-21 June 2010
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Metal-insulator-semiconductors structures (MIS) with a layer of silicon nanocrystals embedded within two SiO2 layers are fabricated by using plasma enhanced chemical vapor deposition. By using current-voltage (I-V) measurements with different sweep rates, we study the mechanism of electrons and holes charging/discharging characteristic of the MIS structures. Distinct current peaks duo to electrons (holes) charging into the nc-Si dots and discharging out of the nc-Si dots are observed. The current peaks are depended on the sweep rate and the areas of current peaks have been used to calculate the charged charge density. The experimental result demonstrates that each nc-Si dots underlying the electrode is charged by one carrier.
  • Keywords
    MIS structures; elemental semiconductors; nanofabrication; nanostructured materials; plasma CVD; semiconductor quantum dots; silicon; silicon compounds; MIS structures; Si; SiO2-Si-SiO2; charge density; current-voltage measurements; electrode; electron-hole charging current peaks; electron-hole charging-discharging characteristics; metal-insulator-semiconductor structures; plasma enhanced chemical vapor deposition; silicon nanocrystals; Charge carrier processes; Chemical vapor deposition; Current measurement; Electrodes; Metal-insulator structures; Nanocrystals; Plasma chemistry; Plasma measurements; Plasma properties; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photonics and Optoelectronic (SOPO), 2010 Symposium on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-4963-7
  • Electronic_ISBN
    978-1-4244-4964-4
  • Type

    conf

  • DOI
    10.1109/SOPO.2010.5504405
  • Filename
    5504405