DocumentCode
2942651
Title
Sensorized guidewires with MEMS tri-axial force sensor for minimally invasive surgical applications
Author
Lou, Liang ; Ramakrishna, Kotlanka ; Shao, Lichun ; Park, Woo-Tae ; Yu, Daquan ; Lim, Lishiah ; Wee, Yongjun ; Kripesh, Vaidyanathan ; Feng, Hanhua ; Chua, Benjamin S Y ; Lee, Chengkuo ; Kwong, Dim-Lee
Author_Institution
A*Star Inst. of Microelectron., Singapore, Singapore
fYear
2010
fDate
Aug. 31 2010-Sept. 4 2010
Firstpage
6461
Lastpage
6464
Abstract
This paper describes the design of a tri-axial microelectromechanical force sensor (FS) that can be mounted on the tip of the guidewire. Piezoresistive silicon nanowires (SiNW) are embedded into a cross cantilever design with a manoeuvrable stylus to allow the detection of force in all directions. The electrical resistance changes in the four SiNWs are used to decode an arbitrary force applied onto the FS. The sensitivity of the device can be improved by two orders of magnitude compared to bulk Si thanks to the giant piezoresistive effects offered by the SiNW. Robustness of the FS is improved due to the novel design by incorporating a mechanical stopper at the tip of the stylus. Finite element analysis (FEM) analysis was used in designing the FS.
Keywords
bioMEMS; cantilevers; finite element analysis; force sensors; nanowires; piezoresistive devices; silicon; surgery; FEM; MEMS tri-axial force sensor; Si; electrical resistance; finite element analysis; giant piezoresistive effects; guidewires; microelectromechanical force sensor; minimally invasive surgary; piezoresistive silicon nanowires; Finite element methods; Force; Force sensors; Piezoresistance; Silicon; Strain; Surgery; MEMS; Minimally invasive surgery; finite element analysis; sensorized guidewire; tactile sensor; tri-axial force sensor; Biosensing Techniques; Equipment Design; Finite Element Analysis; Humans; Nanowires; Surgical Procedures, Minimally Invasive;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
Conference_Location
Buenos Aires
ISSN
1557-170X
Print_ISBN
978-1-4244-4123-5
Type
conf
DOI
10.1109/IEMBS.2010.5627345
Filename
5627345
Link To Document