DocumentCode :
2942717
Title :
Ultrasonically actuated silicon-microprobe-based testicular tubule metrology
Author :
Ramkumar, Abhishek ; Lal, Amit ; Paduch, Darius A. ; Schlegel, Peter N.
Author_Institution :
SonicMEMS Lab., Cornell Univ., Ithaca, NY, USA
fYear :
2010
fDate :
Aug. 31 2010-Sept. 4 2010
Firstpage :
6469
Lastpage :
6472
Abstract :
We report on a microfabricated silicon microprobe integrated with an ultrasonic actuator and polysilicon strain gauges for Microdissection TEsticular Sperm Extraction (TESE) surgery. Multiple microprobe insertion experiments were performed on rat testis tissue and, by monitoring the tubule puncture artifacts in the force signal sensed by the microprobe, we were able to estimate the average diameter of the sperm-carrying tubules in the sample. We have demonstrated the ability to sense the existence of larger tubules embedded in a mass of thinner tubules, by means of an Area-Ratio based metric using an analytically calculated expression for the distribution of sizes measured by the microprobe. This information is important in microdissection TESE to distinguish tubules with and without fertile sperm, potentially eliminating the large incision currently required for optical spermatazoa localization.
Keywords :
actuators; biomedical ultrasonics; elemental semiconductors; microfabrication; silicon; surgery; Si; area-ratio based metric; fertile sperm; force signal; microdissection TESE; microdissection testicular sperm extraction surgery; optical spermatazoa localization; polysilicon strain gauges; rat testis tissue; sperm-carrying tubules; tubule puncture artifacts; ultrasonically actuated silicon-microprobe-based testicular tubule metrology; Acoustics; Biopsy; Bridge circuits; Silicon; Size measurement; Surgery; Animals; Humans; Male; Microdissection; Rats; Seminiferous Tubules; Silicon; Spermatozoa; Testis; Ultrasonography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
Conference_Location :
Buenos Aires
ISSN :
1557-170X
Print_ISBN :
978-1-4244-4123-5
Type :
conf
DOI :
10.1109/IEMBS.2010.5627348
Filename :
5627348
Link To Document :
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