DocumentCode :
2942989
Title :
Bipolar Pulse Electroforming in Precision Mold Tooling of Nonmetal Mandrel
Author :
Li Hongyou ; Liu Xiaomei ; Guo Yinbiao ; Jiang Chen ; Wang Hui
Author_Institution :
Coll. of Mech. Eng. & Autom., Huaqiao Univ., Quanzhou, China
Volume :
3
fYear :
2009
fDate :
11-12 April 2009
Firstpage :
30
Lastpage :
33
Abstract :
Electroforming is the use of electrodeposition of metal onto a master that is subsequently separated from the deposit to produce a metal shell. The ability to manufacture complex parts to close tolerances and cost effectively has meant that electroforming has applications both in precision mold tooling. Because of simplifying technical process and shortening molding cycles, electroforming is also a rapid manufacturing technology. Bipolar pulsed current electroforming is known to result in better precision and surface finish. In this paper, bipolar pulse current electroforming is introduced. Experiments on nickel electroforming in nonmetal mandrel have been done. The results indicated bipolar pulse current could improve the quality and precision further, reduce internal stress further.
Keywords :
electrodeposition; electroforming; internal stresses; moulding; moulding equipment; nickel; precision engineering; shells (structures); surface finishing; bipolar pulsed current electroforming; electrodeposition; internal stress; metal shell; nickel electroforming; nonmetal mandrel; precision mold tooling; rapid manufacturing technology; surface finish; Cathodes; Coatings; Manufacturing; Optical filters; Optical pulses; Optical pumping; Pulse measurements; Pulsed power supplies; Surface cleaning; Surface treatment; Precision manufacturing; bipolar pulse current; electroforming; molds and dies;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Measuring Technology and Mechatronics Automation, 2009. ICMTMA '09. International Conference on
Conference_Location :
Zhangjiajie, Hunan
Print_ISBN :
978-0-7695-3583-8
Type :
conf
DOI :
10.1109/ICMTMA.2009.538
Filename :
5203141
Link To Document :
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