• DocumentCode
    29430
  • Title

    Hybrid Temperature Sensor Network for Area-Efficient On-Chip Thermal Map Sensing

  • Author

    Seungwook Paek ; Wongyu Shin ; Jaeyoung Lee ; Hyo-Eun Kim ; Jun-Seok Park ; Lee-Sup Kim

  • Author_Institution
    Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • Volume
    50
  • Issue
    2
  • fYear
    2015
  • fDate
    Feb. 2015
  • Firstpage
    610
  • Lastpage
    618
  • Abstract
    Spatial thermal distribution of a chip is an essential information for dynamic thermal management. To get a rich thermal map, the sensor area is required to be reduced radically. However, squeezing the sensor size is about to face its physical limitation. In this background, we propose an area-efficient thermal sensing technique: hybrid temperature sensor network. The proposed sensor architecture fully exploits the spatial low-pass filtering effect of thermal systems, which implies that most of the thermal information resides in very low spatial frequency region. Our on-chip sensor network consists of a small number of accurate thermal sensors and a large number of tiny relative thermal sensors, responsible for low and high spatial frequency thermal information respectively. By combining these sensor readouts, a thermal map upsampler synthesizes a higher spatial resolution thermal map with a proposed guided upsampling algorithm.
  • Keywords
    low-pass filters; readout electronics; temperature sensors; thermal management (packaging); area-efficient on-chip thermal map sensing; dynamic thermal management; hybrid temperature sensor network; sensor architecture; sensor readouts; sensor size squeezing; spatial low-pass filtering effect; spatial thermal distribution; thermal map upsampler; thermal sensing technique; Accuracy; Algorithm design and analysis; Clocks; System-on-chip; Temperature sensors; Temperature sensors; area-efficient; collaborative sensing; microprocessors; spatial low-pass filtering effect;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.2014.2375335
  • Filename
    7015615