DocumentCode
2943204
Title
Ultrasonic heating with waveguide interstitial applicator array
Author
Jarosz, B.J.
Author_Institution
Ottawa-Carleton Inst. for Phys., Carleton Univ., Ottawa, Ont., Canada
Volume
2
fYear
1997
fDate
19-21 May 1997
Firstpage
1344
Abstract
Ultrasound interstitial applicators can be used for heating tumors near air and bone interfaces where use of non-invasive ultrasound methods becomes difficult. We describe in this paper an ultrasonic waveguide three-applicator array for interstitial waveguide three-applicator array for interstitial thermotherapy. We first discuss the temperature distribution and the pattern of heat deposition using the effective thermal conductivity equation. This equation is used then for finite element analysis of temperature modelling. We discuss heating in porcine brain tissue and present results with the array in a large volume tissue phantom. We compare the simulation results with the experiment. The average difference between measured and simulation temperatures was <0.4°C. Finally, we show that the arrays can be useful for thermotherapy if thermal conductivity of the medium is lowered or if modified, more powerful applicators are used
Keywords
acoustic waveguides; biomedical ultrasonics; brain; finite element analysis; radiation therapy; temperature distribution; ultrasonic applications; ultrasonic effects; 0.4 C; effective thermal conductivity equation; finite element analysis; heat deposition; interstitial thermotherapy; microthermistors; porcine brain tissue; simulation; temperature distribution; temperature modelling; thermal conductivity; thermotherapy; tissue phantom; tumors; ultrasonic heating; ultrasonic waveguide three-applicator array; Applicators; Bones; Brain modeling; Equations; Heating; Medical treatment; Neoplasms; Temperature measurement; Thermal conductivity; Ultrasonic imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Instrumentation and Measurement Technology Conference, 1997. IMTC/97. Proceedings. Sensing, Processing, Networking., IEEE
Conference_Location
Ottawa, Ont.
ISSN
1091-5281
Print_ISBN
0-7803-3747-6
Type
conf
DOI
10.1109/IMTC.1997.612417
Filename
612417
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