Title :
Patterned Media Based on Soft/Hard, Composite Nanowire Array of Ni/CoPt
Author :
Gapin, A. ; Ye, X. ; AuBuchon, J.F. ; Chen, L. ; Jin, S.
Author_Institution :
Univ. of California at San Diego, La Jolla
Abstract :
A composite nanowire geometry consisting of soft magnetic (Ni) nanowire lower part and hard magnetic (CoPt) L10 nanowire upper part, has been prepared by electrodeposition into anodized aluminum oxide (AAO) nanopores with ~20-30 nm diameter, ~100 nm tall. The as-deposited nanowires within the AAO pores were then annealed at 700 degree C for 1 hour for conversion to L10 phase. The The microstructure and magnetic properties were characterized using scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDX) and an alternating gradient magnetometer (AGM). When compared to Ni nanowire and CoPt nanowire coercivity, the two-step Ni/CoPt nanowires exhibit an intermediate coercivity of ~ 1.96 KOe. The decrease in coercivity may be caused by exchange interactions or the interdiffusion during annealing between the Ni and CoPt segments resulting in the formation of a ternary L10 alloy of Co-Pt-Ni.
Keywords :
X-ray chemical analysis; alumina; annealing; anodisation; chemical interdiffusion; cobalt alloys; coercive force; composite materials; electrodeposition; exchange interactions (electron); magnetic switching; nanowires; nickel; permanent magnets; platinum alloys; scanning electron microscopy; soft magnetic materials; AGM; EDX; Ni-CoPt; SEM; alternating gradient magnetometer; annealing; anodized aluminum oxide nanopores; coercivity; energy dispersive X-ray analysis; exchange interactions; interdiffusion; magnetic properties; magnetic switching; microstructure; patterned media; scanning electron microscopy; soft-hard composite nanowire array; temperature 700 C; time 1 hour; Aluminum oxide; Annealing; Coercive force; Geometry; Magnetic force microscopy; Magnetic properties; Microstructure; Nanoporous materials; Scanning electron microscopy; Soft magnetic materials;
Conference_Titel :
Magnetics Conference, 2006. INTERMAG 2006. IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-1479-2
DOI :
10.1109/INTMAG.2006.376287