Title :
Vertical cavity surface emitting lasers for the tera era
Author_Institution :
Hewlett-Packard Labs., Palo Alto, CA, USA
Abstract :
Summary form only given. We are reaching one of the most important aspects of the tera era is the need for high-speed interconnections between computers and peripherals. The use of optical interconnects using low-cost optoelectronic components will be key to the development of computer networks of the future. A very important technology which will enable high-speed optical interconnects is the vertical cavity surface emitting laser (VCSEL) technology. These lasers can be made and tested in a fashion similar to light emitting diodes, allowing low-cost manufacturing, and can be made into two-dimensional arrays, allowing unique signal processing capabilities. Many R&D groups are busy developing VCSEL technology. The state-of-the-art of VCSEL technology has reached a very impressive level with threshold currents of the order of 100 μA and internal efficiencies greater than 50%. VCSELs have been developed over a wide wavelength range from 650nm to 1550 nm using conventional epitaxial growth techniques or more sophisticated techniques such as wafer fusing and bonding.
Keywords :
computer networks; optical communication equipment; optical interconnections; semiconductor growth; semiconductor laser arrays; surface emitting lasers; wafer bonding; 100 muA; 650 to 1550 nm; computer networks; epitaxial growth techniques; high-speed interconnections; internal efficiencies; optical interconnects; signal processing capabilities; threshold currents; two-dimensional arrays; vertical cavity surface emitting lasers; wafer bonding; wafer fusing; Computer networks; Computer peripherals; Light emitting diodes; Manufacturing processes; Optical interconnections; Optical surface waves; Semiconductor laser arrays; Surface emitting lasers; Testing; Vertical cavity surface emitting lasers;
Conference_Titel :
Device Research Conference Digest, 1997. 5th
Conference_Location :
Fort Collins, CO, USA
Print_ISBN :
0-7803-3911-8
DOI :
10.1109/DRC.1997.612455