• DocumentCode
    2943887
  • Title

    Simulations of transport regime in electrodeposition in different viscosity scenarios

  • Author

    Grinbank, S. Gutman ; Soba, A. ; Gonzalez, G.A. ; Constanzo, G. Díaz ; Bogo, H.A. ; Marshall, G.

  • Author_Institution
    Lab. de Sist. Complejos, UBA, Buenos Aires, Argentina
  • fYear
    2010
  • fDate
    Aug. 31 2010-Sept. 4 2010
  • Firstpage
    3241
  • Lastpage
    3244
  • Abstract
    In this work we study the effects of viscosity variations in thin-layer electrochemical deposition (ECD) under galvanostatic conditions through experimental measurements and theoretical modeling. The theoretical model, written in terms of dimensionless quantities, describes diffusive, migratory and convective ion transport in a fluid under galvanostatic conditions. Experiments reveal that as viscosity increases, convection decreases when the cell resistance remains constant. Our numerical model predicts that as viscosity increases, electroconvection becomes less relevant and concentration and convective fronts slow down. The time scaling of this phenomenon is studied and compared to previously reported low viscosity solution studies.
  • Keywords
    biodiffusion; biological fluid dynamics; cellular transport; convection; electrodeposition; flow simulation; ionic conductivity; numerical analysis; physiological models; viscosity; cell resistance; convection; convective ion transport; diffusive transport; dimensionless quantities; electrodeposition; galvanostatic conditions; migratory transport; numerical model; theoretical modeling; thin-layer electrochemical deposition; time scaling; viscosity scenarios; Anodes; Conductivity; Current density; Electric potential; Numerical models; Viscosity; Biocompatible Materials; Computer Simulation; Electromagnetic Fields; Electroplating; Ion Transport; Models, Chemical; Solutions; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2010 Annual International Conference of the IEEE
  • Conference_Location
    Buenos Aires
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-4123-5
  • Type

    conf

  • DOI
    10.1109/IEMBS.2010.5627407
  • Filename
    5627407