Title :
Efficiency AMHS for twin FAB manufacture
Author :
Liu, An ; Chia-Cheng Kuo ; Chien-Chih Chiu
Author_Institution :
Powerchip Semicond. Corp., Hsinchu
Abstract :
This paper addresses the challenges facing PSC in the automation transport of twin FAB (FAB12AB). According to FAB output strategy, we have to consider the bottleneck of transportation and equipments/AMHS layout constraints. Further improved the INTER-FAB transportation capability. In our original INTER-FAB design capacity is 4400 move/day. After improved, we gained the extra 4600 move/day. It means we have improved the INTER-FAB transportation capability by 105%. In addition, the INTER-FAB transport time decreases from 18 min/move to 13 min/move.
Keywords :
integrated circuit design; integrated circuit manufacture; materials handling; semiconductor device manufacture; AMHS layout constraints; AMHS system; INTER-FAB design capacity; INTER-FAB transportation capability; twin FAB manufacture; Buffer storage; Delay; Loading; Logic; Manufacturing automation; Production; Pulp manufacturing; Relays; Road transportation; Semiconductor device manufacture;
Conference_Titel :
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4244-1142-9
Electronic_ISBN :
1523-553X
DOI :
10.1109/ISSM.2007.4446803
