DocumentCode
2944076
Title
Efficiency AMHS for twin FAB manufacture
Author
Liu, An ; Chia-Cheng Kuo ; Chien-Chih Chiu
Author_Institution
Powerchip Semicond. Corp., Hsinchu
fYear
2007
fDate
15-17 Oct. 2007
Firstpage
1
Lastpage
5
Abstract
This paper addresses the challenges facing PSC in the automation transport of twin FAB (FAB12AB). According to FAB output strategy, we have to consider the bottleneck of transportation and equipments/AMHS layout constraints. Further improved the INTER-FAB transportation capability. In our original INTER-FAB design capacity is 4400 move/day. After improved, we gained the extra 4600 move/day. It means we have improved the INTER-FAB transportation capability by 105%. In addition, the INTER-FAB transport time decreases from 18 min/move to 13 min/move.
Keywords
integrated circuit design; integrated circuit manufacture; materials handling; semiconductor device manufacture; AMHS layout constraints; AMHS system; INTER-FAB design capacity; INTER-FAB transportation capability; twin FAB manufacture; Buffer storage; Delay; Loading; Logic; Manufacturing automation; Production; Pulp manufacturing; Relays; Road transportation; Semiconductor device manufacture;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1523-553X
Print_ISBN
978-1-4244-1142-9
Electronic_ISBN
1523-553X
Type
conf
DOI
10.1109/ISSM.2007.4446803
Filename
4446803
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