DocumentCode :
2944377
Title :
Economic analysis of 450mm wafer migration
Author :
Chien, Chen-Fu ; Wang, J.K. ; Chang, Tzu-Ching ; Wu, Wen-Chin
Author_Institution :
Taiwan Semicond. Manuf. Co, Hsinchu
fYear :
2007
fDate :
15-17 Oct. 2007
Firstpage :
1
Lastpage :
4
Abstract :
To achieve the required continuous cost reduction driven by Moore´s Law, both miniaturization through technology advances and wafer size increase have been employed in order to maintain the growth and profitability of semiconductor industry. Although some technical analyses have been done for 450 mm migration, little research has been done on economic analysis to justify the decisions and thus suggest appropriate timing for 450 mm migration. This study aims to fill the gap by proposing a preliminary economic analysis to clarify some myths and facilitate further discussions concerning collaborations among the stakeholders including equipment vendors, customers, and chipmakers.
Keywords :
cost reduction; electronics industry; integrated circuit economics; profitability; semiconductor device manufacture; wafer-scale integration; Moore´s Law; continuous cost reduction; economic analysis; miniaturization; profitability; semiconductor industry; size 450 mm; stakeholders; wafer migration; Collaboration; Costs; Electronics industry; Investments; Manufacturing industries; Moore´s Law; Productivity; Research and development; Semiconductor device manufacture; Timing; 450mm; Fab Economics; manufacturing strategy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Conference_Location :
Santa Clara, CA
ISSN :
1523-553X
Print_ISBN :
978-1-4244-1142-9
Electronic_ISBN :
1523-553X
Type :
conf
DOI :
10.1109/ISSM.2007.4446818
Filename :
4446818
Link To Document :
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