• DocumentCode
    2944469
  • Title

    Copy smart technology transfer

  • Author

    Tucker, David ; Fearon, Paul ; Landry, Marc ; Rock, Jerald

  • Author_Institution
    Nat. Semicond., Portland
  • fYear
    2007
  • fDate
    15-17 Oct. 2007
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Transferring technologies among factories is a common practice. Numerous factors which drive this include: adding a second source, consolidating technologies, purchasing processes, and adding capacity for new processes. Transferring facilities can be company to company; site to site within a manufacturer; from old to new tool sets; small to larger wafer sizes and include other complicating scenarios. At National Semiconductor, recent transfers involved existing technologies among three fabrication sites. In this paper the evolved transfer process is reviewed along with a discussion of obstacles, methods to counter these issues and best practice techniques.
  • Keywords
    facility location; semiconductor device manufacture; copy smart technology transfer; multisite transfer project; Gold; Implants; Measurement standards; Metrology; Risk management; Semiconductor device manufacture; Statistical analysis; Technology transfer; Testing; Thickness measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1523-553X
  • Print_ISBN
    978-1-4244-1142-9
  • Electronic_ISBN
    1523-553X
  • Type

    conf

  • DOI
    10.1109/ISSM.2007.4446824
  • Filename
    4446824