DocumentCode :
2944469
Title :
Copy smart technology transfer
Author :
Tucker, David ; Fearon, Paul ; Landry, Marc ; Rock, Jerald
Author_Institution :
Nat. Semicond., Portland
fYear :
2007
fDate :
15-17 Oct. 2007
Firstpage :
1
Lastpage :
4
Abstract :
Transferring technologies among factories is a common practice. Numerous factors which drive this include: adding a second source, consolidating technologies, purchasing processes, and adding capacity for new processes. Transferring facilities can be company to company; site to site within a manufacturer; from old to new tool sets; small to larger wafer sizes and include other complicating scenarios. At National Semiconductor, recent transfers involved existing technologies among three fabrication sites. In this paper the evolved transfer process is reviewed along with a discussion of obstacles, methods to counter these issues and best practice techniques.
Keywords :
facility location; semiconductor device manufacture; copy smart technology transfer; multisite transfer project; Gold; Implants; Measurement standards; Metrology; Risk management; Semiconductor device manufacture; Statistical analysis; Technology transfer; Testing; Thickness measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Conference_Location :
Santa Clara, CA
ISSN :
1523-553X
Print_ISBN :
978-1-4244-1142-9
Electronic_ISBN :
1523-553X
Type :
conf
DOI :
10.1109/ISSM.2007.4446824
Filename :
4446824
Link To Document :
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