DocumentCode
2944469
Title
Copy smart technology transfer
Author
Tucker, David ; Fearon, Paul ; Landry, Marc ; Rock, Jerald
Author_Institution
Nat. Semicond., Portland
fYear
2007
fDate
15-17 Oct. 2007
Firstpage
1
Lastpage
4
Abstract
Transferring technologies among factories is a common practice. Numerous factors which drive this include: adding a second source, consolidating technologies, purchasing processes, and adding capacity for new processes. Transferring facilities can be company to company; site to site within a manufacturer; from old to new tool sets; small to larger wafer sizes and include other complicating scenarios. At National Semiconductor, recent transfers involved existing technologies among three fabrication sites. In this paper the evolved transfer process is reviewed along with a discussion of obstacles, methods to counter these issues and best practice techniques.
Keywords
facility location; semiconductor device manufacture; copy smart technology transfer; multisite transfer project; Gold; Implants; Measurement standards; Metrology; Risk management; Semiconductor device manufacture; Statistical analysis; Technology transfer; Testing; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2007. ISSM 2007. International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1523-553X
Print_ISBN
978-1-4244-1142-9
Electronic_ISBN
1523-553X
Type
conf
DOI
10.1109/ISSM.2007.4446824
Filename
4446824
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